FPC Lamination Machine
Application:
Adhesive Tape die cutting and applying for PCB assembly. Suitable for 3M, Tesa, Kapton, High temperature adhesive, Pressure sensitive adhesive, PI electromagnetic, etc.
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Features:
1.Wide range of application: 3M/ Tesa/ Kapton high temperature adhesive/ Pressure sensitive adhesive etc
2. Tape cutting and applying fulfilled synchronously, high precision, high efficient, 10 times as skilled workers.
3. Release film stripped off automatically.
4. Cut adhesive tape into different shape with different size.
5. Can scrape off the glue automatically to make a hand-tear.
6. High punching/applying speed 0.28 - 0.5 sec each time.
7. Repeatability accuracy ±0.005mm
8. High pixel smart camera to locate marks precisely, tight tolerance ±0.07mm.
9. HIWIN Screw Guide to guarantee accuracy.
10. Approved by our well-known clients, the supply chain of APPLE, SAMSUNG, ZTE, FOX-LINK, TRULY, KINWONG, JZRXD, HOLITECH, SCC, SUNFLEX, QTFLEX, HI-LINK, CAREER etc
Parameters:
Application range FPC self-adhesive tape laminating Application field 3M/tesa/Kapton high-temperature
resistancetapes / PI / EMILaminating spindle type Sigle-spindle/pneumatic X,Y dynamical system Servo dynsmics Screw guide High precision grinding screw guide Repeatability tolerance ±0.005 Products laminating tolerance ±0.075 Laminating speed 0.4s Applicable product size MIN:50*50mm,MAX:270*400mm(Customized) Applicable self-adhesive tape size MIN:0.8*3mm,MAX:30*100mm Power supply/air supply AC220V 3.0KW/0.5-0.8MPa Equipment weight 600KGS Equipment size 1200*1000*1720mm Preview of New Products